PART |
Description |
Maker |
25AA640T-I/SN 25AA640-I/ST 25AA640-I/P 25LC640X-E/ |
Evaluation Kit for the MAX1715 Evaluation Kit for the MAX1879 Evaluation Kit for the MAX1864 3µs, 12-Bit ADC Evaluation Kit for the MAX1717 Notebook CPU Step-Down Controller for Intel Mobile Voltage Positioning (IMVP-II) SPI串行EEPROM
|
Luxo, Corp.
|
0354216802 35421-6802 |
Tab Crimp Terminal 35421, AVS (CAVS) 0.50-1.25mm2 (.020-.050) Tab Crimp Terminal 35421, AVS (CAVS) 0.50-1.25mm虏 (.020-.050")
|
Molex Electronics Ltd.
|
AN3317 |
PCB guidelines for SPEAr1340
|
STMicroelectronics
|
AN3222 |
Demonstration board user guidelines
|
STMicroelectronics
|
AN4211 |
Guidelines for soldering MEMS microphones
|
STMicroelectronics
|
25C320-E/ST 25C320T-/ST 25LC320T-/ST 25C320-/P 25C |
CMOS, 10-Bit A/D Converter with Track and Hold Evaluation Kit for the MAX1858, MAX1875, MAX1876 Dual, High-Efficiency, Step-Down Converter with Backup Battery Switchover Evaluation Kit for the MAX1774 SPI Serial EEPROM Evaluation Kit for the MAX1846, MAX1847 3µs, 12-Bit ADC Evaluation Kit for the MAX1776 SPI串行EEPROM
|
Microchip Technology, Inc.
|
ND3260 |
Print Circuit Board Design Guidelines
|
Neodio
|
AN400 |
Si474X ANTENNA, SCHEMATIC, LAYOUT, AND DESIGN GUIDELINES
|
Silicon Laboratories
|
AN981 |
USB - ST92163 EMULATOR AND EPROM FOOTPRINT COMPATIBILITY GUIDELINES
|
SGS Thomson Microelectronics
|
35420-9802 |
Tab Crimp Terminal 35420, AVS (CAVS) 0.50-1.25mm2 (.020-.050)
|
Molex Electronics Ltd.
|
HDMP-1526 |
Transistor Diode Kit;Contents Of Kit:Transistor/Diode Kit Fibre Channel Transceiver Chip
|
HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
|